Principal Package Engineer
At Delos Data Inc · Palo Alto; Palo Alto, California, United States
Salary: $180,000–$270,000 a year
- Engineering
- Full-time
- Staff or principal
See how well you match Match me reads your CV and picks the jobs that suit you best.
Get jobs like this within hours Radar emails you new jobs open to you within hours of us finding them, before most people see them.
Where you’ll work
Hybrid, based in Palo Alto
“Palo Alto”
From the location.
“Palo Alto, California, United States”
From the job board field.
The job board lists it as hybrid.
Hybrid means some days in the office. The listing says how many, and where.
Report a mistake
- Posted
- 1 October 2026
- First seen by us
- 3 November 2026
- Last checked
- 4 hours ago
Job description
From Delos Data Inc’s job post, as they wrote it.
Who We Are
We are a startup building foundational technology to address performance, scalability, and resiliency challenges in large‑scale AI data center clusters. We are backed by top‑tier VC firms and notable angel investors. The company is led by experienced builders and operators who have founded companies, taken them to scale, and exited successfully. We work with a strong sense of unity and shared responsibility, and we expect trust, integrity, and respect in how we collaborate and make decisions. We hold ourselves accountable to one another and to the quality of the work we deliver. Headquartered in Silicon Valley, we operate across a mix of remote and on‑site locations in the U.S. and Canada. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
Read the full description
Some Recent Press: https://www.eetimes.com/startup-boosts-scale-up-to-1000-gpus-in-a-single-domain/
What We Need
A Senior Packaging Engineer responsible for architecting and delivering advanced multi‑die IC packages for high‑performance AI accelerators. This role focuses on package architecture, substrate design, manufacturability, and vendor engagement.
Key Responsibilities
* Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
* Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints.
* Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.
* Perform high-speed signal escaping, routing and power distribution network design.
* Manage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.
* Partner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system‑level needs.
* Evaluate emerging packaging technologies and drive adoption for next‑generation products.
* Support package‑level bring‑up, failure analysis, debug and qualification.
Required Skills & Qualifications
* B.S./M.S. in Electrical Engineering or related field.
* Experience with multi‑die package design and UCIe (AP/SP) integration.
* Understanding of substrate materials, stack‑ups, and mechanical constraints.
* Familiarity with SI/PI concepts to collaborate effectively with electrical teams.
* Experience managing packaging subcontractors.
* Experience interfacing with TSMC/OSAT for bumping and packaging options.
* Knowledge of package modeling tools (HFSS, Sigrity, or similar) is a plus.
Compensation
Target base salary for this role is $180,000–$270,000 per year + meaningful equity + benefits + 401k. Our salary ranges are determined by role, level, experience, and location.
We are an equal opportunity employer. We value a range of perspectives and experiences and make employment decisions based on merit and business needs. We do not discriminate on the basis of legally protected characteristics.
Agency Note:
We do not accept resumes from agencies or search firms. Please do not forward candidate profiles through our careers page, email, LinkedIn messages, or directly to company employees. Any resumes submitted will be deemed the property of the company, and no fees will be paid in the event the candidate is hired.
#LI-EW1
Principal Package EngineerDelos Data Inc
Apply on Delos Data Inc (opens in a new tab)Get jobs like this by email
Once a week, we email the new remote jobs open where you live, each with the line that proves it. Every email has a one-click unsubscribe.
